Improve Process Stability in Drying and Curing with Compact Reflow Systems

It provides gentle heating and long-term operation, making it suitable for resin curing and moisture-proofing agent drying.

Are you experiencing any of these problems in your material drying and curing processes?

Resin curing, drying of moisture-proofing agents and coatings.
Heating in material processing is not as simple as just “heating it up.”

• Only the surface dries first
• Solvent remains inside
• The finish is unstable even though the conditions seem to be correct

In many cases, these problems are not caused by the material itself, but by the way it is heated.
This page explains why Antom’s small reflow ovens are effective in material drying and curing processes.

Common problems that occur when heating materials

In heating processes for materials, the following problems are frequently observed:

• Strong hot air causes roughness of the surface
• Surface hardening occurs first, preventing the interior from drying
• Finish varies depending on the lot and arrangement
• Time management relies on intuition

All of these stem from “the way heat is applied is not controlled”.

Furthermore, in drying and hardening processes, applying heat rapidly in a short time can actually destabilize the quality.

• The surface forms a film first
• Solvents and moisture inside become difficult to remove
• The material surface becomes wavy or flowy

What is important for materials is to apply gentle, uniform heat for the required amount of time.

Why small reflow ovens are suitable for material processing

Small reflow ovens are originally designed for processes that require high reproducibility.
This characteristic is directly applicable to the drying and curing of materials.

• Stable temperature distribution inside the oven
• Not excessively strong hot air
• Conditions can be controlled numerically

The process can be designed based on “what kind of temperature history was passed through” rather than “how many minutes it was baked.”

Long-term heating using low-speed and step-by-step conveying.

Antom’s compact reflow ovens offer precise heating control tailored to your material processing needs.

• Extremely slow conveying speed
• Step conveying with a fixed pause within the oven

This allows you to replicate the following conditions without relying on an oven:

• Long drying time
• Gentle heating
• Uniform heat retention

The crucial difference between a small reflow oven and a regular oven.

In a conventional oven, the following inevitably occur:

• Differences due to placement
• Differences due to stacking
• Variations due to human judgment

However, in a small reflow oven, the workpiece always passes through the same route and under the same conditions.

As a result,

• Condition setting becomes clearer
• Reproducibility improves
• Quality explanation becomes easier

These changes occur.

Main applications in heating materials

Many processes that seem to require a dedicated material furnace can actually be handled by a small reflow oven.

Examples of past implementations include:

• Drying and curing of resins (*)
• Drying of moisture-proofing agents and coating materials
• Heat treatment of impregnation materials and coating materials
• Long-term, low-load heating processes
*Epoxy resins, silicone resins, magnetic powder compounds, potting materials, etc.

As you can see, it is used for drying and curing various materials and solvents.

Antom’s unique heating approach

Antom’s compact reflow ovens employ a heating method that does not rely on strong hot air.

• Do not move the material
• Do not rapidly heat only the surface
• Deliver heat gently to the interior

It is designed with the highest priority on preserving the properties of the material and ensuring stable quality.

For those struggling with the drying and curing processes of materials and solvents.

We propose heating conditions tailored to the characteristics of your materials and solvents.

Please feel free to contact us for consultations regarding the introduction of small reflow ovens, as well as for demonstrations using actual equipment and profile measurements.

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