UNI-6131 Reflow Oven for 12-inch Wafers
UNI-6131 Compact Reflow Oven for 12-inch Wafers | C4 Bump, Low Oxygen, Up to 400°C

The UNI-6131 is a next-generation compact reflow oven designed with an ultra-compact footprint of less than 2 meters in total length.
Engineered for advanced thermal processes in semiconductor, electronic component, and advanced packaging applications, it supports 310 mm width workpieces as well as 12-inch wafer processing.
The system complies with SEMI S2 and S8 standards, is CE certified, supports GEM communication, and is compatible with cleanroom environments up to Class 1,000.
By combining hot air circulation with far-infrared heating technology, the UNI-6131 achieves excellent temperature reproducibility and highly stable thermal profiles.
Despite its compact size, it is capable of reproducing thermal profiles comparable to those of large-scale reflow ovens, making it suitable for prototyping, research and development, high-mix low-volume production, and advanced packaging processes.
The UNI-6131 is a lead-free compatible compact reflow oven that delivers both space-saving efficiency and energy-saving performance.
Basic specifications
| Number of zones | 6 heating zones / 1 cooling zone |
| Heating method | Upper and lower hot air + far infrared heating method |
| Maximum set temperature | Top 350℃ / Bottom 350℃ |
| Board effective width | 50~310mm |
| Conveying method (selectable) | Pin chain conveying / Mesh conveying |
| Conveying speed | 0.1~0.5m/min |
| Part effective height | Top surface 10mm / Bottom surface 10mm |
| Oxygen concentration meter | Standard equipment |
| Supported languages | Japanese, English, Chinese, Korean |
| PC outlet | 1 piece (100V) |
| PCB mounting space (pin chain transport) | 4mm |
| Pass line | 900±20mm |
| Input power | AC200V 3φ 15kVA 44A (Peak power suppression mode) |
| Stable power consumption | Approximately 5kW/h |
| Equipment dimensions * (Numbers in parentheses indicate dimensions when using mesh conveying) | L1,990×D1,320×H1,410mm |
| Equipment weight | 800kg |
Option
| Automatic width adjustment mechanism |
| Overheating Prevention Device |
| Substrate Drop Sensor |
| Simple maintenance-type flux recovery |
| UPS (Uninterruptible Power Supply) |
| High temperature compatible (maximum setting temperature 400℃) |
| Oxygen Concentration Controller |
| N2 All-Zone Supply |
| Oxygen Concentration All-Zone Sampling |
| Low oxygen concentration specification (100 ppm or less) |
| Inlet/outlet conveyor extension |
| Circulation fan stop detection |
| Hood interlock |
| Reflow checker (profile measurement unit) |
| Various conveyors (conveyor, cooling conveyor, loader, unloader) |
| Various Customization Options Available |
In addition to the specifications and options listed, we can also customize the product to suit your application and process conditions.
Please feel free to contact us regarding special specifications and individual requirements. You can also download a PDF catalog summarizing the detailed specifications of UNI-6131 from the link below.
If it’s difficult to make a decision based solely on the specifications, we will propose the most suitable heating process without being limited by the listed specifications. Please feel free to contact us using the form below.
Click here for the Japanese version of our homepage.
