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UNI-6131 Reflow Oven for 12-inch Wafers

A compact reflow oven compatible with 12-inch wafers (transport width 310 mm).

UNI-6131 Compact Reflow Oven for 12-inch Wafers | C4 Bump, Low Oxygen, Up to 400°C

UNI-6131 Compact Reflow Oven for 12-inch Wafers | C4 Bump, Low Oxygen, Up to 400°C
The UNI-6131 is a next-generation compact reflow oven designed with an ultra-compact footprint of less than 2 meters in total length.
Engineered for advanced thermal processes in semiconductor, electronic component, and advanced packaging applications, it supports 310 mm width workpieces as well as 12-inch wafer processing.
The system complies with SEMI S2 and S8 standards, is CE certified, supports GEM communication, and is compatible with cleanroom environments up to Class 1,000.
By combining hot air circulation with far-infrared heating technology, the UNI-6131 achieves excellent temperature reproducibility and highly stable thermal profiles.
Despite its compact size, it is capable of reproducing thermal profiles comparable to those of large-scale reflow ovens, making it suitable for prototyping, research and development, high-mix low-volume production, and advanced packaging processes.
The UNI-6131 is a lead-free compatible compact reflow oven that delivers both space-saving efficiency and energy-saving performance.

Basic specifications
Number of zones 6 heating zones / 1 cooling zone
Heating method Upper and lower hot air + far infrared heating method
Maximum set temperature Top 350℃ / Bottom 350℃
Board effective width 50~310mm
Conveying method (selectable) Pin chain conveying / Mesh conveying
Conveying speed 0.1~0.5m/min
Part effective height Top surface 10mm / Bottom surface 10mm
Oxygen concentration meter Standard equipment
Supported languages Japanese, English, Chinese, Korean
PC outlet 1 piece (100V)
PCB mounting space (pin chain transport) 4mm
Pass line 900±20mm
Input power AC200V 3φ 15kVA 44A (Peak power suppression mode)
Stable power consumption Approximately 5kW/h
Equipment dimensions * (Numbers in parentheses indicate dimensions when using mesh conveying) L1,990×D1,320×H1,410mm
Equipment weight 800kg
Option
Automatic width adjustment mechanism
Overheating Prevention Device
Substrate Drop Sensor
Simple maintenance-type flux recovery
UPS (Uninterruptible Power Supply)
High temperature compatible (maximum setting temperature 400℃)
Oxygen Concentration Controller
N2 All-Zone Supply
Oxygen Concentration All-Zone Sampling
Low oxygen concentration specification (100 ppm or less)
Inlet/outlet conveyor extension
Circulation fan stop detection
Hood interlock
Reflow checker (profile measurement unit)
Various conveyors (conveyor, cooling conveyor, loader, unloader)
Various Customization Options Available

In addition to the specifications and options listed, we can also customize the product to suit your application and process conditions.
Please feel free to contact us regarding special specifications and individual requirements. You can also download a PDF catalog summarizing the detailed specifications of UNI-6131 from the link below.

UNI-6131 Compact Reflow Oven for 12-inch Wafers | C4 Bump, Low Oxygen, Up to 400°C

If it’s difficult to make a decision based solely on the specifications, we will propose the most suitable heating process without being limited by the listed specifications. Please feel free to contact us using the form below.


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