Medium-sized reflow oven (N2 compatible) EXSOL-8231N
Medium-sized reflow oven (N2 compatible) EXSOL-8231
Medium-sized reflow oven (N2 compatible) EXSOL-8231
Basic specifications
Number of zones | 8 heating zones / 2 cooling zones |
---|---|
Heating method | Upper hot air + far infrared heating/lower far infrared heating method |
Maximum set temperature | Top 320℃ / Bottom 350℃ |
Effective board width | 50~310mm |
Transport method (selectable) | Pin chain transportation / Mesh transport |
Transport speed | 0.3~1.5m/min |
Part effective height | Top surface 10mm / Bottom surface 10mm |
Oxygen concentration meter | Standard equipped |
Flux recovery | Standard (easy maintenance type) |
Supported languages | Japanese, English, Chinese, Korean |
PC outlet | 1 (100V) |
Board placement space | 4mm |
Pass line | 900+20,-15mm |
Input power | AC200V 3φ 24kVA 70A (peak power suppression mode) |
Stable power consumption | About 8kW/h |
Device dimensions | L4,110×D1,320×H1,410mm |
Device weight | 1,750kg |
Options
Automatic width adjustment mechanism |
Overheating prevention mechanism |
Board drop sensor |
Elevating type warpage prevention mechanism |
UPS (uninterruptible power supply) |
Oxygen concentration controller |
Oxygen concentration all zone sampling |
Labyrinth up/down mechanism |
Bottom circulation |
Low oxygen concentration specification (100ppm or less) |
Circulation fan stop detection |
Hood interlock |
Reflow checker (profile measurement unit) |
Various conveyors (transport conveyor, cooling conveyor, loader, unloader) |
Various customizations available |