Introducing the Antom heating furnace, which is useful for applications other than reflow (board mounting).

Antom Co., Ltd.’s compact reflow has features that other reflow does not have, and is used not only for board mounting (soldering) but also in “all industries (applications)” that require heat.
This page will introduce its features.

Six features of Antom heating furnace

Overwhelming miniaturization	The industry’s smallest class of conveyor type heating with a total length of 2m or less (available up to 4m)
Wide temperature range	Temperature can be set from room temperature to 350℃ (Custom settings available up to 400℃)
Flexible heating time	Heating can be adjusted from a few seconds to several hours (custom heating can be done even when the transport is stopped)
Outstanding temperature stability	Achieved a maximum variation of within 5℃ on the same surface (variation due to workpiece heat capacity)
Breezy heating with reduced air volume	Using a combination of far infrared rays and hot air to heat the breeze, we suppress the harmful effects of strong winds and improve quality
Clean room compatible as standard	The standard clean specification (class 10000) improves area productivity. (Class 100 achieved)

Application examples of Antom heating furnace, which is useful for various purposes

1. In-line thermostat using transport method
2.Drying and baking the paint
3. Curing of resin (adhesive, etc.)
4. Burn-in of semiconductor components
5.Heat resistance evaluation screening
6. High-temperature soldering such as gold-tin soldering

Achieves stable temperature control and high reproducibility

Our heating furnace allows you to set the temperature for each upper and lower zone, making temperature control easy.
Also, unlike batch furnaces that use constant temperature chambers, this method is conveyor-transported, so one of its features is its high reproducibility, which allows it to produce the same results over and over again.
Furthermore, by making fine adjustments to temperature, conveyance speed, hot air volume, etc., it is possible to reproduce conditions (temperature profile) that match the characteristics of the workpiece (thickness, material, heat capacity, etc.).

Various conveyance methods can be selected according to the shape of the workpiece

Generally, the transportation method used for board mounting is the “pin chain transportation method,” but if you want to transport the workpiece on a carrier or jig, or if you want to increase production by using multi-row transportation, you can use the “mesh chain transportation method.” “Transport method” is valid. The pin chain method is effective if the back side of the work cannot be contacted with the conveyance part, but we also offer a “mesh conveyance jig” that can reproduce mesh conveyance depending on the situation. Recently, we have also been receiving many requests for direct transportation of microscopic chip parts, and in such cases, we can also provide customized transportation such as fine mesh or heat-resistant fluororesin to suit the customer’s application.
In this way, we offer a wide variety of transportation methods that match the shape of your workpiece.

If you have any problems regarding heating, please feel free to contact us.

For inquiries regarding the heating equipment (small reflow, drying oven) or peripheral equipment provided by our company, please use the form below.
Please feel free to contact us for consultations regarding the introduction of heating equipment, as well as demonstrations using actual equipment and profile measurements.

Product inquiry form

As a general rule, a representative will contact you regarding your inquiry using the form below within 2 business days (works on weekdays), so please wait a moment.
If you do not hear from our representative after 2 business days, there is a possibility that the email may not have been delivered, so please contact us again by phone.

Also, after you make an inquiry using the form, you will receive an automatic reply email confirming receipt, but please do not reply to this email.