We will introduce the benefits of our unique heating method that uses both hot air and far infrared rays.

The heating method used in all of Antom Co., Ltd.’s (hereinafter referred to as our company) reflow and heating furnace lineups is a hybrid heating method that uses a combination of hot air and far infrared rays.
In addition, by reducing the air volume (strength of hot air) compared to the general hot air heating method reflow, it has the advantage of preventing the negative effects of strong hot air on heating.

Below is a diagram illustrating our unique heating method, a hybrid heating method that uses both hot air and far infrared rays.

The system is such that the air generated by the sirocco fan passes through the panel heater, which is the heat source, and the heated air turns into hot air and heats the workpiece.
In addition, a specially coated plate is attached to the surface of the panel heater, which greatly improves the far-infrared effect, so that even if the amount of hot air is reduced, the heating capacity will not decrease.This is our hybrid that uses both hot air and far-infrared rays. It is a heating method.

In addition, if it is necessary to increase the heating capacity, such as when increasing the heating capacity of a workpiece with a large heat capacity, it is possible to increase the amount of hot air by adjusting the air volume, so it is not necessarily possible to only heat the workpiece with a reduced amount of hot air.

By utilizing this hybrid heating method that combines hot air and far infrared rays, you can obtain the following benefits.

Advantages of hybrid heating method using hot air + far infrared rays

The biggest feature of our hybrid heating method, which combines hot air and far infrared rays, is that it suppresses the negative effects of strong hot air by reducing the amount of hot air.
Below we will introduce some of the benefits that can be obtained by using our hybrid heating method that combines hot air and far infrared rays.

Improves soldering quality by suppressing flux deterioration	Flux (an additive that increases the ability to remove the oxide film on the surface of the solder and the bonded surface), which plays the most important role in soldering, deteriorates due to hot air if the preheating time is long. . As a result, the necessary flux becomes insufficient due to deterioration, and the solder cannot be fully activated during the actual heating, which can lead to defects such as insufficient wetting and spreading (self-alignment). In addition, insufficient flux may prevent air bubbles from coming out during solder melting, causing the solder to solidify and cause voids. The simplest way to solve these problems is to suppress hot air so that the flux does not deteriorate.
Ideal for drying solvents, fine parts, and thin workpieces	When drying solvents such as moisture-proofing agents, applying strong hot air to the solvent may cause waving or scattering. Similarly, thin workpieces such as micro parts, films, and flexible circuit boards can also be blown away or fluttered by strong hot air. In order to suppress the effects of such strong hot air, our hybrid heating method that uses a combination of hot air and far infrared rays, which reduces the amount of hot air, is optimal.
Less thermal interference with adjacent zones and upper and lower zones	If the amount of hot air is strong, there will be interference with adjacent zones and zones above and below, so the temperature tends to be pulled toward the zone with a higher set temperature. Therefore, it is not possible to create large temperature differences between adjacent zones or between the top and bottom. However, our hybrid heating method, which uses both hot air and far infrared rays, minimizes temperature interference between adjacent zones and upper and lower zones by suppressing the amount of hot air, making it possible to create sharp temperature differences. . Additionally, since the space between adjacent zones can be minimized, it also has the effect of suppressing drop-off between zones.

Below is a photo comparing the occurrence of voids between the general hot air heating method reflow (air reflow) and our hybrid heating method that uses hot air + far infrared rays.
The deterioration of the flux caused by hot air impedes the fluidity of the solder, and the resulting gas is trapped within the fillet (solder shape formed between the lead and land), resulting in voids.
In other words, by reducing the amount of hot air, the flux does not deteriorate, and by maximizing the fluidity of the solder, the amount of voids can be reduced.

Although it is not possible to completely eliminate voids like a vacuum furnace, this much reduction in voids can be achieved simply by changing the heating method.
If you would like to minimize the occurrence of voids, please consider our hybrid heating method that uses a combination of hot air and far infrared rays.

Please check our hybrid heating method using a combination of hot air and far infrared rays on an actual machine.

As mentioned above, all of our reflow and heating furnaces use a hybrid heating method that uses both hot air and far infrared rays.
Therefore, you can use the demo machine permanently installed in the demo room to check out the hybrid heating method that uses both hot air and far infrared rays.